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• Probes & Accessories

BondMaster 600
Overview

The BondMaster 600 is a bond testing software with advanced digital electronics, ensuring consistently clear, high-quality signals.

It excels at inspecting a variety of materials, from honeycomb composites to metal-to-metal and laminate bonds. Its user-friendly interface, with direct-access keys and convenient presets for common applications, makes it exceptionally easy to operate. Additionally, the enhanced interface and simplified workflow offer seamless archiving and reporting, making it accessible to users of all experience levels.

BondMaster 600
Key Features

• Designed to meet the requirements of IP66
• Long battery life (up to 9 hours).
• Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.
• Bright, 5.7-inch color VGA display.
• Full-screen option in any display mode.
• Intuitive interface with application-specific presets.
• Instant display mode toggle using the RUN key.
• New SCAN view (profile).
• New SPECTRUM view and Frequency Tracking feature.
• Direct-access key gain adjustment.
• All-Settings configuration page screen.
• Up to two real-time readings.
• Storage capacity of up to 500 files (program and data).
• On-board file preview.